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FOR IMMEDIATE RELEASE US Patent and Trademark Office Issued a US patent to Terence Chan, DynetixUS Patent No. 7,334,203Feb 25, 2008 The US Patent and Trademark office issued a patent, US 7,334,203, to Terence Chan on Feb 19, 2008. The patent "RaceCheck: A Race Logic Analyzer Program for Digital Integrated Circuits" depicts a set of state-of-the-art methods to detect race logic, both statically and dynamically, in advanced HDL- and ESL-based digital integrated circuits, such as multi-billion gate SoC, ASIC, FPGA, and custom IC designs. According to Terence Chan, race logic is a very critical IC design issue that has been overlooked by both IC designers and EDA vendors. For examples, SoC circuits that include IP components from different vendors and/or design teams will most likely incur race logic when those IP components are stitched together, and the current EDA tools provided inadequate coverage for race logic. Worst yet, some EDA tools (e.g., logic simulators and formal verification tools) mask the effects of race logic, and provide a false-sense of confidence for the functional coverage of user test benches. If race logic is not detected and corrected in IC designs, their corresponding IC products may exhibit indeterminate behavior, and may render product recall. Dynetix RaceCheckTM product was developed from the ground up and dedicated to audit hard-to-detect race logic that are not covered by any current EDA tools. Specifically, RaceCheckTM technology was based on the US patent 7,334,203, and it detects all race logic issues, both statically and dynamically, in HDL (Verilog, VHDL) and ESL (SystemVerilog and SystemC) designs. RaceCheckTM could be used to drastically improve the quality of both user IC designs and test benches. Finally, RaceCheckTM complements V2simTM to provide an advanced comprehensive and accelerated functional verification solution for large-scale SoC, ASIC, FPGA, and custom-IC designs. Both the RaceCheckTM and V2simTM products are available now in production release. For More Information Contact:
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